Advanced High-Precision Thin Film Sputtering Systems
From our top-of-the-line MCT-8000 Cluster Tool to the batch throughput 2480 RF Diode system, China Advanced Ceramic MeiVac group has a history of designing and building high-performance thin-film deposition systems for demanding market requirements.
Precision MCT-8000 Cluster Tool
Developed as a high reliability, high uptime, expandable system platform, China Advanced Ceramic MeiVac MCT-8000 Cluster Tool was optimized for hard disk drive thin film head applications.
DetailsPrecision 602 Single Wafer System
China Advanced Ceramic MeiVac 602 series sputtering system was developed as a high reliability, high uptime, expandable system platform for the deposition of thin alumina gap layers.
Details2480 RF Diode Batch System
China Advanced Ceramic MeiVac HEDA RF Diode sputtering system family was developed as a high throughput batch deposition system for thick alumina layers utilized in thin film heads for the magnetic storage industry.
DetailsRetrofits & Upgrades
- 602/2480 GMO (Gas Management Option)
- Auto Phase Shifter/Monitor
- 2480 Uniformity Enhancement Retrofit
- 602 Robot Upgrade (Brooks Platform)
- 602 Wafer Temperature Sensor
- 602/2480 Wafer Size Upgrade 5″ to 6″ to 8″
R&D and Process Improvements
Whether you need a tool for a 24/7 production fab or are still in the development phase, the MeiVac team will work with your researchers and engineers to maximize the process performance of a new or existing tool.
DetailsCustom MeiVac Systems
MeiVac has a history of designing and building tools to meet customers’ unique needs.
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