- Company
- Semiconductor Equipment RelatedThermo-electric Modules
- Automotive Related
- Semiconductor Equipment RelatedFerrofluidic Seals (FerroSeals)
- Semiconductor Equipment RelatedFine Ceramics Components
- Semiconductor Equipment RelatedMachinable Ceramics Components
- Semiconductor Equipment RelatedEB Components
- Electronic Device RelatedFerrofluid
Power Electronic Substrates
Direct Bond Copper &
Active Metal Brazing
DBC
Direct Bond Copper
Insulation board for heat dissipation using thermo-module manufacturing technology
DBC (Direct Bond Copper) board is an electronic component that forms a copper circuit by directly bonding a copper plate to a ceramics substrate such as alumina or aluminum nitride.
It is widely used in power devices that require efficient heat dissipation as well as electrical insulation.
The use of modular products for automobiles as well as for industrial and commercial use will continue to expand.
AMB
Active Metal Brazing
AMB board for power electronic substrates.
High reliability is achieved by the active metal brazing method.
High reliability is achieved by the active metal brazing method.
The SiN-AMB board has no concern about environmental performance and electromigration, and the heat cycle test ensures high reliability without peeling and cracking of the copper plate even after 3000 cycles.
