Aluminum Nitride Ceramic Material

Aluminium Nitride is frequently selected for its thermal conductivity and its resistance to attack by fluorine plasmas.

Applications

  • Chamber parts for semiconductor process equipment
  • Heat radiation substrate

Silicon Nitride Ceramics Products Photo

Properties

ALN99 ALN94
General properties Characteristics High purity High thermal conductivity
Main component purity (wt%) 99 94
Color Light gray Light gray
Density (g/cm3) 3.24 3.31
Water absorption (%) 0 0
Mechanical properties Bending strength (MPa) 295 345
Young’s modulus (GPa) 320 320
Vickers hardness (GPa) 11 11
Thermal properties Max. operating temperature (°C) 1000 1000
Coefficient of thermal expansion (1/°C×10-6) RT~500°C 4.4 4.4
RT~800°C 5.1 5.1
Coefficient of thermal conductivity (W/m×K) 80 150
Thermal shock resistance ΔT (°C) 300 400
Electrical properties Volume resistivity 25°C 1014 1014
300°C 108 1010
500°C 107 107
800°C 105 105
Dielectric constant 10GHz 8.5 8.5
Dielectric loss (×10-4) 30 30
Q factor (×104) 0.03 0.03
Dielectric breakdown voltage (KV/mm)

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